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Ammonium thiosulfate extraction of gold from printed circuit boards (PCBs) of end-of-life mobile phones and its recovery from pregnant leach solution by cementation
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| Title: | Ammonium thiosulfate extraction of gold from printed circuit boards (PCBs) of end-of-life mobile phones and its recovery from pregnant leach solution by cementation |
| Authors: | Jeon, Sanghee Browse this author | | Tabelin, Carlito Baltazar Browse this author | | Park, Ilhwan Browse this author | | Nagata, Yoshito Browse this author | | Ito, Mayumi Browse this author →KAKEN DB | | Hiroyoshi, Naoki Browse this author →KAKEN DB |
| Keywords: | Ammonium thiosulfate leaching | | Gold | | Cementation | | Printed circuit boards | | Recycling |
| Issue Date: | Jan-2020 |
| Publisher: | Elsevier |
| Journal Title: | Hydrometallurgy |
| Volume: | 191 |
| Start Page: | 105214 |
| Publisher DOI: | 10.1016/j.hydromet.2019.105214 |
| Abstract: | In this study, the ammonium thiosulfate leaching of gold (Au) from printed circuit boards (PCBs) of end-of-life mobile phones and the subsequent recovery of dissolved metals from pregnant leach solution via cementation were elucidated under various conditions. Over 99% of Au was extracted from crushed PCBs (D-50 = 85 mu m) under the following conditions: 1 M of Na2S2O3, 10 mM of CuSO4, 1 M of ammonia/ammonium concentration, 0.1 g/10 ml of solid-to-liquid ratio, and a 24-h of leaching time in the presence of oxygen. In contrast, the recovery of Au ions via cementation was more favorable in the absence of oxygen. Among the various cementation agents evaluated, copper (Cu) was the most selective and recovered around 95% of extracted Au from the pregnant leach solution even in the presence of various coexisting metal ions. The cementation of Au exhibited two distinct kinetic regions: (1) an initially rapid rate, and (2) a more gradual and constant rate. Finally, the use of Cu plates to recover Au ions from ammonium thiosulfate pregnant solution of crushed PCBs is proposed, which could selectively recover about 80% of dissolved Au and is easier to handle and reuse compared with Cu powder. |
| Rights: | © 2020. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/ | | http://creativecommons.org/licenses/by-nc-nd/4.0/ |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/83731 |
| Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: Jeon Sanghee
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