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Direct Imaging of Individual Organic Molecules in Supramolecular Assembly Strongly Fixed via Multivalent Electrostatic Interactions
Title: | Direct Imaging of Individual Organic Molecules in Supramolecular Assembly Strongly Fixed via Multivalent Electrostatic Interactions |
Authors: | Akita, Ikumi Browse this author | Ishida, Yohei Browse this author | Yonezawa, Tetsu Browse this author →KAKEN DB |
Keywords: | Platinum | Molecules | Two dimensional materials | Clay | Minerals |
Issue Date: | 4-Mar-2021 |
Publisher: | American Chemical Society |
Journal Title: | Journal of physical chemistry c |
Volume: | 125 |
Issue: | 8 |
Start Page: | 4917 |
End Page: | 4923 |
Publisher DOI: | 10.1021/acs.jpcc.1c00738 |
Abstract: | Recent developments in electron microscopy and novel techniques for the precise control of low-dimensional substrate materials have led to the emergence of direct imaging of organic molecules. However, supramolecular assemblies constructed via noncovalent interactions are structurally unstable under electron beam irradiation. This study focused on a supramolecular assembly of well-isolated organic molecules based on multivalent electrostatic interactions, where anionically charged clay mineral nanosheets were used as a host material. Direct imaging of the single organic molecules and supramolecular assemblies on the monolayer clay mineral nanosheets was achieved via annular dark field scanning transmission electron microscopy using heavy metal atom markers. The versatility of multivalent electrostatic interactions for the stable fixation of organic molecules during electron microscopic imaging was demonstrated. This strategy can be applied to a wide range of supramolecular systems comprising various guest molecules and host materials, thereby broadening the scope of atomic-scale imaging. |
Rights: | This document is the Accepted Manuscript version of a Published Work that appeared in final form in Journal of physical chemistry C, copyright c American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see http://pubs.acs.org/articlesonrequest/AOR-HV5CCMZYVV8KQYC5GGB5. |
Type: | article (author version) |
URI: | http://hdl.handle.net/2115/84288 |
Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 石田 洋平
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