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Current Behaviors of NI REBCO Pancake Coil Wound With Multi-Bundled Conductors During Charging and Against Local Normal-State Transition

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Title: Current Behaviors of NI REBCO Pancake Coil Wound With Multi-Bundled Conductors During Charging and Against Local Normal-State Transition
Authors: Kodaka, Kazuma Browse this author
Noguchi, So Browse this author →KAKEN DB
Keywords: Thermal stability
Insulation
Equivalent circuits
Delays
Magnetic fields
Circuit stability
Windings
Charging delay
high magnetic field generation
multi-bundled REBCO tape
no-insulation winding technique
Issue Date: 7-Apr-2022
Publisher: IEEE (Institute of Electrical and Electronics Engineers)
Journal Title: IEEE transactions on applied superconductivity
Volume: 32
Issue: 6
Start Page: 4603105
Publisher DOI: 10.1109/TASC.2022.3164854
Abstract: No-insulation(NI) Rare-Earth Barium Copper Oxide (REBCO) pancake coils can generate high magnetic fields and have the high thermal stability against normal-state transition due to allowing currents to radially bypass a local normal-state region through the turn-to-turn contacts. Despite these merits, no turn-to-turn insulation causes a charging delay. To solve this charging delay problem, an NI REBCO coil wound with multi-bundled (MB) conductors was proposed. As an experimental result, a charging delay was improved because the inductance per tape of MB coil is smaller than that of single-tape NI coil. Meanwhile, the current behaviors of MB coils are complicated and has not been clarified. We have investigated the current and thermal behaviors of MB REBCO coils during charging and against normal-state transition, comparing with and without turn-to-turn insulation. As the result, it is shown that the MB coil can be operated stably, and no pessimistic temperature rise is observed. However, the operating current of MB coils with turn-to-turn insulation may concentrate on one tape when the normal-state transition occurs. Therefore, MB coils without turn-to-turn insulation seems to be desirable.
Rights: © 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Type: article (author version)
URI: http://hdl.handle.net/2115/85552
Appears in Collections:情報科学院・情報科学研究院 (Graduate School of Information Science and Technology / Faculty of Information Science and Technology) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 野口 聡

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