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Mechanical fabrication of metal nano contacts showing conductance quantization under electrochemical potential control

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Title: Mechanical fabrication of metal nano contacts showing conductance quantization under electrochemical potential control
Other Titles: Mechanical fabrication of metal nano-contacts showing conductance quantization under electrochemical potential control
Authors: Kiguchi, Manabu Browse this author
Konishi, Tatsuya Browse this author
Miura, Shinichi Browse this author
Murakoshi, Kei Browse this author
Keywords: Metal nano constrictions
Metal nano-constrictions
Quantized conductance
Electrochemical potential
Issue Date: Nov-2005
Publisher: Elsevier
Journal Title: Physica E: Low-dimensional Systems and Nanostructures
Volume: 29
Issue: 3-4
Start Page: 530
End Page: 533
Publisher DOI: 10.1016/j.physe.2005.06.020
Abstract: We have mechanically fabricated Ni and Cu nano constrictions in solution, and studied their electrical conductance under the electrochemical potential control. Conductance quantization can be observed with both metals. This is the first observation of the conductance quantization behavior for non-gold metal nano constrictions, which are mechanically fabricated in solution at room temperature. The conductance of Cu was quantized in units of G0 (=2e2/h), and a sharp 1 G0 peak is observed in the conductance histogram. For Ni, a conductance plateau showed a slightly negative slope, and a broad peak at 1~1.5 G0 was observed in the histogram. The conductance quantization behavior was discussed by comparing the result of nano constrictions fabricated in non-solution condition, with those fabricated by an electrochemical method. It is suggested that a certain atomic configuration was stabilized in solution under the electrochemical potential control.
Relation: http://www.sciencedirect.com/science/journal/13869477
Type: article (author version)
URI: http://hdl.handle.net/2115/8610
Appears in Collections:理学院・理学研究院 (Graduate School of Science / Faculty of Science) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 木口 学

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