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Fabrication of superhydrophobic copper metal nanowire surfaces with high thermal conductivity

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Title: Fabrication of superhydrophobic copper metal nanowire surfaces with high thermal conductivity
Authors: Yamamoto, Ryota Browse this author
Kowalski, Damian Browse this author
Zhu, Ruijie Browse this author
Wada, Keisuke Browse this author
Sato, Yuki Browse this author
Kitano, Sho Browse this author →KAKEN DB
Zhu, Chunyu Browse this author
Aoki, Yoshitaka Browse this author →KAKEN DB
Habazaki, Hiroki Browse this author →KAKEN DB
Keywords: Copper
Thermal conductivity
Water condensation
Issue Date: 30-Jan-2021
Publisher: Elsevier
Journal Title: Applied surface science
Volume: 537
Start Page: 147854
Publisher DOI: 10.1016/j.apsusc.2020.147854
Abstract: Copper is an important practical metal with a high thermal conductivity that is widely used as a heat exchanger material. However, a liquid film often forms on the Cu surface through water vapor condensation, causing a large resistance to heat transfer. To address this issue, a superhydrophobic Cu metal nanowire surface is developed herein via Cu anodizing in a KOH electrolyte to form Cu(OH)(2) nanowires, followed by hydrogen reduction at an elevated temperature and the application of a wet organic coating. The hydrogen treatment reduces the hydroxide to the metal while maintaining the nanowire morphology. The superhydrophobic Cu metal nanowire surface exhibits effective removal of water droplets formed through water vapor condensation. Furthermore, the metal nanowire surface exhibits highly improved heat transfer compared with the Cu(OH)(2) nanowire surface. Therefore, the combined process of anodizing and hydrogen reduction is a simple approach that forms an effective superhydrophobic Cu surface with high thermal conductivity.
Rights: ©2021. This manuscript version is made available under the CC-BY-NC-ND 4.0 license
Type: article (author version)
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 幅崎 浩樹

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