Surfactant-stabilized copper paticles for low-temperature sintering: Paste preparation using a milling with small zirconia beads : Effect of pre-treatment with the disperse medium

Liu, Shuai; Tokura, Rintaro; Nguyen, Mai Thanh; Tsukamoto, Hiroki; Yonezawa, Tetsu

doi:10.1016/j.apt.2020.10.004


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Surfactant-stabilized copper paticles for low-temperature sintering: Paste preparation using a milling with small zirconia beads : Effect of pre-treatment with the disperse medium

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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/87108

Title:	Surfactant-stabilized copper paticles for low-temperature sintering: Paste preparation using a milling with small zirconia beads : Effect of pre-treatment with the disperse medium
Authors:	Liu, Shuai Browse this author
	Tokura, Rintaro Browse this author
	Nguyen, Mai Thanh Browse this author
	Tsukamoto, Hiroki Browse this author
	Yonezawa, Tetsu Browse this author →KAKEN DB
Keywords:	Copper
	Fine particle
	Conductive
	Paste
	Milling
Issue Date:	Nov-2020
Publisher:	Elsevier
Journal Title:	Advanced Powder Technology
Volume:	31
Issue:	11
Start Page:	4570
End Page:	4575
Publisher DOI:	10.1016/j.apt.2020.10.004
Abstract:	Copper paste is considered as a promising candidate for printed electronics in replacement for silver paste. This is owing to copper which has anti-electromigration property, lower cost, and similar conductivity and compared with silver. We synthesize a copper nanoparticle (NP) paste that can be sintered at low temperature for high conductivity. The copper NP paste composes of 50 wt% copper NPs and dipropylene glycol (DPG) as the disperse medium. The effect of DPG coating and various conditions of milling with small beads on improving the dispersity of copper NPs has been investigated. The optimum conditions for milling are at 1000 and 2000 rpm for 30 min. This results in a volume resistivity of 6.62 x 10(-6) Omega.cm after sintering the copper NP paste at 200 degrees C. (C) 2020 The Society of Powder Technology Japan. Published by Elsevier B.V. and The Society of Powder Technology Japan. All rights reserved.
Rights:	©2021. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/
Rights:	http://creativecommons.org/licenses/by-nc-nd/4.0/
Type:	article (author version)
URI:	http://hdl.handle.net/2115/87108
Appears in Collections:	工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 米澤徹

OAI-PMH ( junii2 , jpcoar_1.0 )

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