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Tailored copper oxidation in alkaline aqueous solution after helium cation implantation
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| Title: | Tailored copper oxidation in alkaline aqueous solution after helium cation implantation |
| Authors: | Yang, Subing Browse this author | | Nakagawa, Yuki Browse this author | | Shibayama, Tamaki Browse this author →KAKEN DB |
| Keywords: | Helium ion implantation | | Copper oxidation | | Copper oxide nanostructure |
| Issue Date: | 30-Jun-2022 |
| Publisher: | Elsevier |
| Journal Title: | Applied surface science |
| Volume: | 591 |
| Start Page: | 153087 |
| Publisher DOI: | 10.1016/j.apsusc.2022.153087 |
| Abstract: | Manipulating Cu oxidation is important for Cu anti-oxidation techniques and Cu oxide fabrication. In this study, Cu oxidation behavior after He+ implantation was observed after exposure to 0.1 M aqueous NaOH, and the underlying microstructural evolution and mechanism were investigated. He+ implantation and some C concomitantly introduced into the Cu surface accelerated formation of a thin oxide layer during the initial oxidation period, resulting in faster initial generation and more rapid growth of CuO during the subsequent oxidation. Furthermore, He+ implantation homogenized the distribution of CuO on the Cu substrate. Our findings will increase researchers' understanding of the oxidation and corrosion behavior of Cu in aqueous alkaline conditions, and provide new insights into designing and growing Cu oxide nanostructures by ion implantation. |
| Rights: | © <2022>. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/ | | http://creativecommons.org/licenses/by-nc-nd/4.0/ |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/91330 |
| Appears in Collections: | エネルギー・マテリアル融合領域研究センター (Center for Advanced Research of Energy and Material) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 柴山 環樹
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