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Thermal analysis of a miniature magnetic fluid seal installed in an implantable rotary pump
This item is licensed under:Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International
| Title: | Thermal analysis of a miniature magnetic fluid seal installed in an implantable rotary pump |
| Authors: | Mitamura, Yoshinori Browse this author →KAKEN DB | | Nishimura, Ikuya Browse this author →KAKEN DB | | Yano, Tetsuya Browse this author →KAKEN DB |
| Keywords: | magnetic fluid seal | | thermal analysis | | temperature | | implantable medical device |
| Issue Date: | 15-Apr-2022 |
| Publisher: | Elsevier |
| Journal Title: | Journal of Magnetism and Magnetic Materials |
| Volume: | 548 |
| Start Page: | 168977 |
| Publisher DOI: | 10.1016/j.jmmm.2021.168977 |
| Abstract: | The capacity of a magnetic fluid (MF) seal is decreased by increased MF temperature. A cooling system for MF is limited in a miniature MF seal installed in an implantable rotary pump. MF temperature in an MF seal installed in an implantable rotary pump was studied. The temperature of MF in a rotary pump was measured in vitro. Also, steady-state thermal analyses were conducted for an implantable rotary pump model. The results showed that (1) the decrease in magnetization of an MF due to increased temperature is negligible when the heat transfer coefficient of the seal housing is greater than 500 W/(m2·K) and (2) the increased temperature is mainly due to heat flux from the motor, and the magnitude of temperature increase due to viscous friction in the MF is low. In conclusion, an MF seal can be used in an implantable rotary pump from the standpoint of heat characteristics. |
| Rights: | ©2022, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/ | | https://creativecommons.org/licenses/by-nc-nd/4.0/ |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/91737 |
| Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 三田村 好矩
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