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Contact Resistance Change Due to Air Gap Generation Between Turns of NI REBCO Pancake Coils
| Title: | Contact Resistance Change Due to Air Gap Generation Between Turns of NI REBCO Pancake Coils |
| Authors: | Sato, Haru Browse this author | | Noguchi, So Browse this author →KAKEN DB |
| Keywords: | No-insulation winding technique | | REBCO magnet | | stress simulation | | turn-to-turn contact resistance |
| Issue Date: | Aug-2024 |
| Publisher: | IEEE (Institute of Electrical and Electronics Engineers) |
| Journal Title: | IEEE transactions on applied superconductivity |
| Volume: | 34 |
| Issue: | 5 |
| Start Page: | 6601905 |
| Publisher DOI: | 10.1109/TASC.2024.3362309 |
| Abstract: | Rare-earth barium copper oxide (REBCO) magnets with excellent current characteristics under high temperature and high magnetic field has been developed for various applications worldwide. No-insulation (NI) REBCO coils allow currents to avoid flowing into normal-state transition regions due to turn-to-turn direct contacts, improving the thermal stability on the NI REBCO coils. The turn-to-turn contact resistances on NI REBCO coils are very important for thermal stability; but they change according to the turn-to-turn contact surface conditions. The contact condition is severely deteriorated when REBCO tape surfaces are not in contact. Our previous research pointed out that deformations on small-bore NI insert coils derived from strong stresses make some air gaps under high external magnetic field and high operating current, resulting in increase in the turn-to-turn contact resistances. In this paper, to investigate the air gap behaviors, an electromagnetic and stress simulation considering individual turn movements is conducted. A contact area ratio and a whole contact resistance of an NI REBCO pancake coil is computed. As the result, under the operating current of 50 A, the turn-to-turn contact conditions deteriorate by air gap generation between turns with the increase of the background fields. However, under 10 T, the turn-to-turn contact conditions improve as the operating current increases beyond 50 A. The air gap related with the distribution pattern of BJR stress, but not the strength of BJR stress. |
| Rights: | © 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/92378 |
| Appears in Collections: | 情報科学院・情報科学研究院 (Graduate School of Information Science and Technology / Faculty of Information Science and Technology) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 野口 聡
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