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Title: 微量元素添加によるSn-低In系はんだの組織特性の評価
Other Titles: Evaluation of the Microstructure Property of Sn-low-In System
Authors: 水野, 宏紀1 Browse this author
鈴木, 直人2 Browse this author
田中, 順一3 Browse this author
成田, 敏夫4 Browse this author
Authors(alt): MIZUNO, Hiroki1
SUZUKI, Naoto2
TANAKA, Junichi3
NARITA, Toshio4
Keywords: Sn-In-Al solder alloy
Thermal fatigue properties
Minute element addition
Issue Date: Feb-2005
Publisher: 社団法人 溶接学会
Journal Title: 11th Symposium on Microjoining and Assembly Technology in Electronics
Volume: 3
Issue: 4
Start Page: 139
End Page: 144
Abstract: It applied to power module solder joint using the Sn-low In system alloy, the heat-cycle test was carried out, and the thermal fatigue property was evaluated from the progress length of a crack. As a result, we investigated microstructure for Sn-In-Al alloy and considered to formation of organization at the time of minute element addition.
Type: article (author version)
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 田中 順一

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