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微量元素添加によるSn-低In系はんだの組織特性の評価
| Title: | 微量元素添加によるSn-低In系はんだの組織特性の評価 |
| Other Titles: | Evaluation of the Microstructure Property of Sn-low-In System |
| Authors: | 水野, 宏紀1 Browse this author | | 鈴木, 直人2 Browse this author | | 田中, 順一3 Browse this author | | 成田, 敏夫4 Browse this author |
| Authors(alt): | MIZUNO, Hiroki1 | | SUZUKI, Naoto2 | | TANAKA, Junichi3 | | NARITA, Toshio4 |
| Keywords: | Sn-In-Al solder alloy | | Thermal fatigue properties | | Minute element addition |
| Issue Date: | Feb-2005 |
| Publisher: | 社団法人 溶接学会 |
| Journal Title: | 11th Symposium on Microjoining and Assembly Technology in Electronics |
| Volume: | 3 |
| Issue: | 4 |
| Start Page: | 139 |
| End Page: | 144 |
| Abstract: | It applied to power module solder joint using the Sn-low In system alloy, the heat-cycle test was carried out, and the thermal fatigue property was evaluated from the progress length of a crack. As a result, we investigated microstructure for Sn-In-Al alloy and considered to formation of organization at the time of minute element addition. |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/943 |
| Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 田中 順一
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