| Type | Author(s) | Title | Other Titles | Citation | Citation(alt) | Issue Date |
| article | 齋藤, 繁; 黒川, 一哉; 林, 重成; 高島, 敏行; 成田, 敏夫 | 1423KにおけるNi-Al-Re系の相平衡と共役組成 | Phase Equilibria and Tie-Lined Compositions in a Ternary Ni-Al-Re System at 1423 K | 日本金属学会誌 | Journal of the Japan Institute of Metals | 1-Sep-2007 |
| article | 齋藤, 繁; 黒川, 一哉; 林, 重成; 高島, 敏行; 成田, 敏夫 | 1423KにおけるRe-Cr-Ni系γ相とσ相の共役組成 | Tie-Lined Compositions of the γ and σPhases in a Ternary Re-Cr-Ni System at 1423 K | 日本金属学会誌 | Journal of the Japan Institute of Metals | 1-Aug-2007 |
| article (author version) | Tanaka, Junichi; Takashima, Toshiyuki; Yoshimi, Kenji; Serizawa, Koji; Narita, Toshio | Development of Micro-structured Sn-2Ag-0.1Al Solder with Highly THermal Fatigue Durability | - | Electronics Goes Green 2004+ (EGG 2004) September 6-8, 2004, Berlin, Germany. | - | Sep-2004 |
| article | 齋藤, 繁; 黒川, 一哉; 林, 重成; 高島, 敏行; 成田, 敏夫 | Re-Cr-Ni系における1423Kの等温状態図の実験的決定 | Experimental Determination of Isothermal Phase Diagram at 1423 K in the Ternary Re-Cr-Ni System | 日本金属学会誌 | Journal of the Japan Institute of Metals | 1-Feb-2008 |
| article (author version) | 田中, 順一; 鈴木, 直人; 高島, 敏行; 成田, 敏夫 | Sn-Ag-Al系合金/Cu接合による界面溶解反応と熱疲労サイクル特性 | Interfacial Dissolution Reaction and Thermal Fatigue Cycle Property for Sn-Ag-Al Solder Alloy/Cu | 10th Symposium on Microjoining and Assembly Technology in Electronics | - | Feb-2004 |
