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Multiband Artificial Magnetic Conductors Using Stacked Microstrip Patch Layers

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Please use this identifier to cite or link to this item:http://hdl.handle.net/2115/13194

Title: Multiband Artificial Magnetic Conductors Using Stacked Microstrip Patch Layers
Authors: Inafune, Koji Browse this author
Sano, Eiichi2 Browse this author →KAKEN DB
Authors(alt): 佐野, 栄一2
Keywords: metamaterial
artificial magnetic conductor
FDTD
electromagnetic simulation
Issue Date: Aug-2005
Citation: 2005 IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (Aug. 2005, Beijing, China)
Abstract: A two-dimensional microstrip patch array with a conducting via connecting the center of each patch to ground has been proposed for an artificial magnetic conductor (AMC). On the other hand, a microstrip patch array without vias has been shown to produce an AMC. This paper analyzes AMC structures with and without vias by using an effective medium model and finite difference time domain (FDTD) full-wave analysis method. The difference between the properties of these AMC structures is investigated in detail. Based on the results, we devised a multiband AMC structure having stacked microstrip patch layers. FDTD calculations and measurements were performed to demonstrate the effectiveness of the multiband AMC.
Conference Name: IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications
Conference Sequence: 2005
Conference Place: Beijing
Type: proceedings (author version)
URI: http://hdl.handle.net/2115/13194
Appears in Collections:量子集積エレクトロニクス研究センター (Research Center for Integrated Quantum Electronics) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 佐野 栄一

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