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Multiband Artificial Magnetic Conductors Using Stacked Microstrip Patch Layers
| Title: | Multiband Artificial Magnetic Conductors Using Stacked Microstrip Patch Layers |
| Authors: | Inafune, Koji Browse this author | | Sano, Eiichi2 Browse this author →KAKEN DB |
| Authors(alt): | 佐野, 栄一2 |
| Keywords: | metamaterial | | artificial magnetic conductor | | FDTD | | electromagnetic simulation |
| Issue Date: | Aug-2005 |
| Citation: | 2005 IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (Aug. 2005, Beijing, China) |
| Abstract: | A two-dimensional microstrip patch array with a conducting via connecting the center of each patch to ground has been proposed for an artificial magnetic conductor (AMC). On the other hand, a microstrip patch array without vias has been shown to produce an AMC. This paper analyzes AMC structures with and without vias by using an effective medium model and finite difference time domain (FDTD) full-wave analysis method. The difference between the properties of these AMC structures is investigated in detail. Based on the results, we devised a multiband AMC structure having stacked microstrip patch layers. FDTD calculations and measurements were performed to demonstrate the effectiveness of the multiband AMC. |
| Conference Name: | IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications |
| Conference Sequence: | 2005 |
| Conference Place: | Beijing |
| Type: | proceedings (author version) |
| URI: | http://hdl.handle.net/2115/13194 |
| Appears in Collections: | 量子集積エレクトロニクス研究センター (Research Center for Integrated Quantum Electronics) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 佐野 栄一
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