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Sudden Discharging and Overcurrent Simulations of REBCO Coils Coated With Conductive Epoxy Resin

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Title: Sudden Discharging and Overcurrent Simulations of REBCO Coils Coated With Conductive Epoxy Resin
Authors: Mato, Takanobu Browse this author
Noguchi, So Browse this author →KAKEN DB
Keywords: Coils
Epoxy resins
Thermal stability
Circuit stability
Windings
Thermal conductivity
Stability criteria
Conductive-epoxy-resin-coated REBCO coil
magnet stability
no-insulation winding technique
quench protection
Issue Date: Aug-2021
Publisher: IEEE (Institute of Electrical and Electronics Engineers)
Journal Title: IEEE transactions on applied superconductivity
Volume: 31
Issue: 5
Start Page: 4600705
Publisher DOI: 10.1109/TASC.2021.3057839
Abstract: In 2011, a no-insulation (NI) winding technique was first proposed. Rare-Earth Barium Copper Oxide (REBCO) pancake coils using the NI winding technique are promising to generate an ultrahigh magnetic field, because the NI winding technique drastically enhances the thermal stability. When a local hot spot appears on a turn of the NI REBCO pancake coil, the enforced current can bypass into the adjacent turns to suppress the Joule heat generation. Recently, different types of REBCO coils to enhance the thermal stability by escaping the current flow from a local hot spot have been researched and developed. A few years ago, a REBCO single pancake coil whose upper surface was coated with conductive epoxy resin was proposed as one kind of NI winding techniques. The high thermal stability of conductive-epoxy-resin-coated (CERC) REBCO single pancake coil was demonstrated through an overcurrent test. However, the current behavior in the coil is still unclear. Therefore, we have newly developed an equivalent circuit model for CERC REBCO pancake coils. The sudden discharging and overcurrent tests were simulated for CERC REBCO pancake coils, and the resistance parameters were varied to investigate the coil stability.
Rights: © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Type: article (author version)
URI: http://hdl.handle.net/2115/81540
Appears in Collections:情報科学院・情報科学研究院 (Graduate School of Information Science and Technology / Faculty of Information Science and Technology) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 野口 聡

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