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High throughput electrochemically driven metal microprinting with multicapillary droplet cell
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| Title: | High throughput electrochemically driven metal microprinting with multicapillary droplet cell |
| Authors: | Bilal, Muhammad Browse this author | | Sakairi, Masatoshi Browse this author →KAKEN DB |
| Keywords: | Electrodeposition | | 3D printing | | Droplet cell | | Ni microrods | | Electrochemistry |
| Issue Date: | Mar-2021 |
| Publisher: | Elsevier |
| Journal Title: | Materials today. Communications |
| Volume: | 26 |
| Start Page: | 102053 |
| Publisher DOI: | 10.1016/j.mtcomm.2021.102053 |
| Abstract: | A high speed and low-cost electrochemical additive manufacturing method for parallel microprinting of metals is proposed. Multicapillary 3D printed solution flow type microdroplet cells (Sf-MDC) with large capillary diameters (600 mu m) are used to electrodeposit high-quality Ni microstructures. Three Ni lines each having a width of around 900 mu m and a thickness of around 24.6 mu m, 20.7 mu m and 15.2 mu m are simultaneously printed on Cu substrate. The influence of temperature and scanning speed on the height of printed Ni lines is studied. Independent control of solutions inside each capillary enables the simultaneous formation of Ni-Cu-Ni and Cu-Ni-Cu microdots without any cross-mixing of solutions. By replacing 3D printed inner capillaries (around 600 mu m in diameter) with silica capillaries (around 100 mu m in diameter) inside the Sf-MDC, free standing 3D structures such as Ni microrods are successfully fabricated. Localized electrodeposition using the Sf-MDC allows parallel process 3D printing of metal microstructures for a wide range of applications. |
| Rights: | © 2021. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/ | | http://creativecommons.org/licenses/by-nc-nd/4.0/ |
| Type: | article (author version) |
| URI: | http://hdl.handle.net/2115/87714 |
| Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 坂入 正敏
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