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Title: Sn-Ag系はんだ組織に与える微量添加Alの効果とその接合性に関する研究
Other Titles: Study of Effect of Al Addition into Sn-Ag Solder on Microstructure and Bondability
Authors: 鈴木, 直人1 Browse this author
田中, 順一2 Browse this author
成田, 敏夫3 Browse this author
Authors(alt): SUZUKI, Naoto1
TANAKA, Junichi2
NARITA, Toshio3
Keywords: Al addition
Ag2Al particles
thermal cycle
crack propagation
Issue Date: Feb-2005
Publisher: 社団法人 溶接学会
Journal Title: 11th Symposium on Microjoining and Assembly Technology in Electronics
Volume: 3
Issue: 4
Start Page: 61
End Page: 66
Abstract: We researched the effect of Al addition into Sn-Ag solder alloys. Addition of small amount of Al into Sn-Ag alloys made sub-grains in the β-Sn phase finer. And many Ag2Al particles were dispersed. Both primary phase and eutectic phase in Sn-Ag-Al alloys were almost evenly deformed against tensile stress. Ag2Al particles obstructed the propagation of crack during thermal cycle, so propagation rate was delayed. Sn-2Ag-0.05Al and Sn-2Ag-0.1Al showed better mechanical property and thermal cycle property than Sn-3Ag-0.5Cu.
Type: article (author version)
Appears in Collections:工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 田中 順一

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