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Sn-Ag系はんだ組織に与える微量添加Alの効果とその接合性に関する研究
Title: | Sn-Ag系はんだ組織に与える微量添加Alの効果とその接合性に関する研究 |
Other Titles: | Study of Effect of Al Addition into Sn-Ag Solder on Microstructure and Bondability |
Authors: | 鈴木, 直人1 Browse this author | 田中, 順一2 Browse this author | 成田, 敏夫3 Browse this author |
Authors(alt): | SUZUKI, Naoto1 | TANAKA, Junichi2 | NARITA, Toshio3 |
Keywords: | Al addition | sub-grain | Ag2Al particles | hardness | deformation | thermal cycle | crack propagation |
Issue Date: | Feb-2005 |
Publisher: | 社団法人 溶接学会 |
Journal Title: | 11th Symposium on Microjoining and Assembly Technology in Electronics |
Volume: | 3 |
Issue: | 4 |
Start Page: | 61 |
End Page: | 66 |
Abstract: | We researched the effect of Al addition into Sn-Ag solder alloys. Addition of small amount of Al into Sn-Ag alloys made sub-grains in the β-Sn phase finer. And many Ag2Al particles were dispersed. Both primary phase and eutectic phase in Sn-Ag-Al alloys were almost evenly deformed against tensile stress. Ag2Al particles obstructed the propagation of crack during thermal cycle, so propagation rate was delayed. Sn-2Ag-0.05Al and Sn-2Ag-0.1Al showed better mechanical property and thermal cycle property than Sn-3Ag-0.5Cu. |
Type: | article (author version) |
URI: | http://hdl.handle.net/2115/944 |
Appears in Collections: | 工学院・工学研究院 (Graduate School of Engineering / Faculty of Engineering) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)
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Submitter: 田中 順一
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