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Studies on atomic layer deposition Al2O3/In0.53Ga0.47As interface formation mechanism based on air-gap capacitance-voltage method

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Title: Studies on atomic layer deposition Al2O3/In0.53Ga0.47As interface formation mechanism based on air-gap capacitance-voltage method
Authors: Yoshida, Toshiyuki Browse this author
Hashizume, Tamotsu Browse this author →KAKEN DB
Keywords: air gaps
alumina
annealing
atomic layer deposition
capacitance
electronic density of states
gallium arsenide
III-V semiconductors
indium compounds
interface states
oxidation
semiconductor-insulator boundaries
Issue Date: 17-Sep-2012
Publisher: American Institute of Physics
Journal Title: Applied Physics Letters
Volume: 101
Issue: 12
Start Page: 122102
Publisher DOI: 10.1063/1.4753927
Abstract: The air-gap capacitance-voltage characteristics of InGaAs surfaces were measured after 1-, 2-, 6-, 9-, and 17-cycle atomic layer deposition (ALD) Al2O3 processing. A high density of mid-gap states was found to be generated and increased during these ALD process steps, while the native oxide component was reduced. On the other hand, the mid-gap state density was drastically reduced after the usual annealing process. The generation of the mid-gap states seemed to be relevant to a non-stoichiometric Al-oxide component associated with a deficit in oxygen atoms, which became re-oxidized during the annealing process.
Rights: Copyright 2012 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Appl. Phys. Lett. 101, 122102 (2012) and may be found at https://dx.doi.org/10.1063/1.4753927
Type: article
URI: http://hdl.handle.net/2115/50404
Appears in Collections:量子集積エレクトロニクス研究センター (Research Center for Integrated Quantum Electronics) > 雑誌発表論文等 (Peer-reviewed Journal Articles, etc)

Submitter: 橋詰 保

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